Electronics Plating

Gold Electroplating
Gold electroplating offers superior corrosion resistance, low contact resistance, and high conductivity, making it ideal for connectors, contacts, circuits, and semiconductors. A nickel undercoating enhances durability, prevents rust penetration, and blocks diffusion of metals like zinc or copper. Typical coatings are thin (e.g., 0.8 microns of gold over 1.3 microns of nickel) to balance cost and performance.

Silver Electroplating
Silver provides excellent electrical and thermal conductivity at a lower cost than gold. It’s commonly used to coat copper components, enhancing conductivity and solderability for connectors and high-current applications. A nickel undercoat reduces tarnishing and prevents silver-copper intermetallics, with coating thickness adjusted for environmental conditions.

Platinum Electroplating
Platinum, a durable and corrosion-resistant precious metal, is used for low-voltage and low-energy contacts. Its electroplating process enhances conductivity and protects against oxidation, with coatings typically ranging from 0.5 to 5 microns for electronics applications.

Rhodium Electroplating
Rhodium’s hardness, high melting point, and low electrical resistance make it ideal for sliding contacts and high-voltage components. Its electroplating process reduces wear and oxidation, ensuring reliable performance in demanding electronic systems.

Palladium and Palladium Alloys
Palladium and its alloys (e.g., palladium-nickel, palladium-cobalt) offer cost-effective alternatives to gold for connectors and lead frames. Palladium-nickel provides low surface contact resistance, while palladium’s lower density reduces component weight. It’s also environmentally friendly compared to tin-lead alloys.

Copper Electroplating
Copper’s excellent electrical and thermal conductivity makes it a go-to choice for semiconductors and circuits. Used as an underplate or primary coating, copper enhances conductivity, corrosion resistance, and deposit consistency, offering a cost-effective solution for electronics.

Tin and Tin Alloys
Tin electroplating is budget-friendly but prone to whisker formation, which can cause electrical shorts. Our tin-lead alloy minimises whiskers while providing excellent solderability, simplifying the electroplating process. Coatings typically range from 0.0003 to 0.0005 inches.

Plating on Plastics
Many electronic components, like knobs and control buttons, use plastic substrates. Copper electroplating metallises these parts, enabling conductivity, while nickel coatings enhance appearance and wear resistance. Our advanced techniques ensure strong adhesion for plastic components like connector blocks and circuit paths.

Electroless Nickel Plating
Electroless nickel plating delivers uniform coatings via chemical reaction, ideal for complex semiconductor surfaces and heat sinks. It enhances solderability, brazing, and corrosion resistance, keeping components cool and durable in high-performance electronics.